Title :
Performance effects of switching noise on CMOS microprocessors
Author :
Becker, W.D. ; McCredie, B.D. ; Singh, B. ; Lin, P.
Author_Institution :
IBM Corp., Poughkeepsie, NY, USA
Abstract :
The simultaneous switching noise of off-chip drivers and internal circuits affect the performance of the CMOS chips. These effects are quantified using voltage waveforms obtained from simulations on a high-frequency package model
Keywords :
CMOS digital integrated circuits; integrated circuit modelling; integrated circuit noise; integrated circuit packaging; microprocessor chips; CMOS microprocessors; high-frequency package model; internal circuits; off-chip drivers; simulation; simultaneous switching noise; voltage waveforms; Capacitance; Capacitors; Ceramics; Circuits; Microprocessors; Packaging; Power distribution; Power supplies; Semiconductor device modeling; Voltage;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1995
Conference_Location :
Portland, OR
Print_ISBN :
0-7803-3034-X
DOI :
10.1109/EPEP.1995.524684
