Title :
Supplement to the Proceeding of Asia and South Pacific Design Automation Conference 1999
Keywords :
Asia; Consumer electronics; Design automation; Electronic design automation and methodology; Electronic packaging thermal management; Embedded software; Microprocessors; Software packages; Speech; Very large scale integration;
Conference_Titel :
Design Automation Conference, 1999. Proceedings of the ASP-DAC '99. Asia and South Pacific
Print_ISBN :
0-7803-5012-X
DOI :
10.1109/ASPDAC.1999.760036
