DocumentCode
3376798
Title
Reliability, thermal, and power modeling and optimization
Author
Dick, Robert P.
Author_Institution
EECS Dept., Univ. of Michigan, Ann Arbor, MI, USA
fYear
2010
fDate
7-11 Nov. 2010
Firstpage
181
Lastpage
184
Abstract
This tutorial provides an overview of challenges to designing and implementing reliable integrated circuits and systems, and suggests areas for future study. It illustrates some concepts in detail, explaining the challenges of appropriately considering the impact of temperature on reliability in fault-tolerant systems. Finally, it points out considerations that may influence adoption of reliability modeling and optimization techniques and stresses the importance of considering the most relevant fault processes during reliability modeling and optimization.
Keywords
fault simulation; integrated circuit modelling; integrated circuit reliability; optimisation; fault process; fault-tolerant systems; optimization techniques; power modeling; reliability modeling; reliable integrated circuits; Circuit faults; Computational modeling; Integrated circuit modeling; Optimization; Power demand; Reliability engineering;
fLanguage
English
Publisher
ieee
Conference_Titel
Computer-Aided Design (ICCAD), 2010 IEEE/ACM International Conference on
Conference_Location
San Jose, CA
ISSN
1092-3152
Print_ISBN
978-1-4244-8193-4
Type
conf
DOI
10.1109/ICCAD.2010.5654140
Filename
5654140
Link To Document