Application of the finite difference time domain (FDTD) method to a challenging real-world EMC problem

Author

Rumsey, Ian ; Piket-May, Melinda

Author_Institution

Dept. of Electr. & Comput. Eng., Colorado Univ., Boulder, CO, USA

Volume

2

fYear

1999

fDate

1999

Firstpage

679

Abstract

As high speed systems place greater demands on electronic packaging and interconnects, numerical simulation at the package and circuit board levels before prototyping is needed to produce designs which meet stringent EMI, EMC, signal integrity, and timing constraints. The finite-difference time-domain technique is an intuitive modeling technique that may be used for a number of interesting EMC problems. This paper discusses initial results for grand challenge problems 2 and 4

Keywords

electromagnetic compatibility; electromagnetic interference; finite difference time-domain analysis; interconnections; packaging; timing; EMI; FDTD method; circuit board level; electronic packaging; finite difference time domain; high speed systems; interconnects; numerical simulation; real-world EMC problem; signal integrity; timing constraints; Electromagnetic compatibility; Electromagnetic interference; Electronics packaging; Finite difference methods; Integrated circuit interconnections; Numerical simulation; Printed circuits; Signal design; Time domain analysis; Virtual prototyping;

fLanguage

English

Publisher

ieee

Conference_Titel

Electromagnetic Compatibility, 1999 IEEE International Symposium on

Conference_Location

Seattle, WA

Print_ISBN

0-7803-5057-X

Type

conf

DOI

10.1109/ISEMC.1999.810099

Filename

810099