• DocumentCode
    3377587
  • Title

    A geometric scattering expansion of the current on conducting surfaces and transmission line structures

  • Author

    Gronwald, Frank ; Nitsch, Jürgen

  • Author_Institution
    Magdeburg Univ. of Technol., Germany
  • Volume
    2
  • fYear
    1999
  • fDate
    1999
  • Firstpage
    739
  • Abstract
    The coupling of electromagnetic fields into complex electronic systems plays an important role in EMC. Especially multiconductor transmission lines (MTLs) transport voltage- and current-perturbations to the entrance of sensitive devices. We derive a perturbative construction scheme for the current on oneand two-dimensional conducting geometries. These conductors can either be in the presence of electromagnetic sources or also be part of the source itself. The current is expressed in terms of a scattering expansion which turns out to be an expansion in the curvature of the conducting geometries. This geometric formalism allows one to perturbatively determine characteristic parameters of arbitrary transmission line structures
  • Keywords
    electric current; electromagnetic compatibility; electromagnetic coupling; electromagnetic fields; electromagnetic induction; electromagnetic wave scattering; integral equations; multiconductor transmission lines; 1D conducting geometry; 2D conducting geometry; EMC; conducting surfaces; current; current-perturbations; curvature; electromagnetic fields coupling; electromagnetic sources; electronic systems; geometric scattering expansion; induced current; integral equation; multiconductor transmission lines; scattering expansion; transmission line structures; voltage-perturbations; Conductors; Electromagnetic compatibility; Electromagnetic coupling; Electromagnetic fields; Electromagnetic scattering; Frequency; Geometry; Integral equations; Partial differential equations; Transmission lines;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility, 1999 IEEE International Symposium on
  • Conference_Location
    Seattle, WA
  • Print_ISBN
    0-7803-5057-X
  • Type

    conf

  • DOI
    10.1109/ISEMC.1999.810110
  • Filename
    810110