Title :
A Biaxially Stretchable Interconnect with Liquid Alloy Joints on Flexible Substrate
Author :
Kim, Hyun-Joong ; Zhang, Meng ; Ziaie, Babak
Author_Institution :
Purdue Univ., Lafayette
Abstract :
This paper reports a new and simple way to fabricate biaxially stretchable interconnects. To increase the stretchability, two novel ideas are suggested. These include 1) a geometry of 2-D diamond shaped gold lines on a PDMS substrate, and 2) coverage of potentially breakable points with liquid alloy. Stretchability of up to 60% was obtained using these techniques.
Keywords :
flexible electronics; interconnections; liquid alloys; biaxially stretchable interconnect; flexible substrate; liquid alloy joints; Biomembranes; Capacitive sensors; Electrical resistance measurement; Fabrication; Gallium alloys; Geometry; Gold alloys; Physics computing; Silicon; Skin; Biaxial; Interconnect; Liquid alloy; PDMS substrate; Stretchable;
Conference_Titel :
Solid-State Sensors, Actuators and Microsystems Conference, 2007. TRANSDUCERS 2007. International
Conference_Location :
Lyon
Print_ISBN :
1-4244-0842-3
Electronic_ISBN :
1-4244-0842-3
DOI :
10.1109/SENSOR.2007.4300453
