DocumentCode
3378264
Title
Practical finite difference time domain (FDTD) shielding analysis of thin coatings and shield bonding methods
Author
Kraemer, John G.
Author_Institution
Rockwell Collins Inc., Cedar Rapids, IA, USA
Volume
2
fYear
1999
fDate
1999
Firstpage
854
Abstract
Thin coatings such as indium tin oxide (ITO) or gold splatter on glass are often used on electronic display enclosures for shielding to allow compliance with radiated emissions standards while allowing optical transmission. The thin coatings are often bonded to the display enclosure to allow realization of the maximum shielding. The bonding is often accomplished by the use of a conductive gasket that mates with a busbar on one or more edges of the thin coating. Shielding effectiveness of the coating and gasket configuration is very difficult to predict using traditional shielding effectiveness equations. This paper shows how 3-dimensional (3D) finite difference time domain (FDTD) simulation and analysis are used to examine trends in shielding effectiveness with respect to gasket characteristics, thin coating characteristics (thickness and conductivity), and bonding methods. Practical simulation and model setup methods are presented. Results are provided for common configurations
Keywords
adhesion; busbars; coatings; digital simulation; display instrumentation; electromagnetic interference; electromagnetic shielding; finite difference time-domain analysis; packaging; 3D FDTD simulation; Au; ITO; InSnO; busbar; conductive gasket; conductivity; electronic display enclosures; finite difference time domain; gasket configuration; glass; gold; indium tin oxide; maximum shielding; model setup methods; optical transmission; practical finite difference time domain; radiated emissions standards; shield bonding methods; shielding analysis; shielding effectiveness equations; thickness; thin coatings; Bonding; Coatings; Displays; Finite difference methods; Gaskets; Glass; Gold; Indium tin oxide; Stimulated emission; Time domain analysis;
fLanguage
English
Publisher
ieee
Conference_Titel
Electromagnetic Compatibility, 1999 IEEE International Symposium on
Conference_Location
Seattle, WA
Print_ISBN
0-7803-5057-X
Type
conf
DOI
10.1109/ISEMC.1999.810157
Filename
810157
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