DocumentCode
3378447
Title
Comparison between metallic carbon nanotube and copper future VLSI nano-interconnects
Author
Maffucci, Antonio ; Miano, Giovanni ; Villone, Fabio
Author_Institution
DAEIMI, Univ. di Cassino, Cassino
fYear
2007
fDate
13-16 May 2007
Firstpage
29
Lastpage
32
Abstract
This paper addresses the problem of scaling interconnects to nanometric dimensions in future VLSI applications. Traditional copper interconnects are compared to innovative ones made by bundles of metallic carbon nanotubes. A new model is presented to describe propagation along CNT bundles, in the framework of the classical transmission line theory. A possible future scaled CNT bundle microstrip is analyzed and compared to a conventional microstrip.
Keywords
VLSI; carbon nanotubes; copper; nanoelectronics; CNT; VLSI nano-interconnects; copper; metallic carbon nanotube; nanometric dimensions; Atomic measurements; Carbon nanotubes; Copper; Current density; Electrodynamics; Electrons; Microstrip; Scattering; Thermal conductivity; Very large scale integration;
fLanguage
English
Publisher
ieee
Conference_Titel
Signal Propagation on Interconnects, 2007. SPI 2007. IEEE Workshop on
Conference_Location
Genova
Print_ISBN
978-1-4244-1223-5
Electronic_ISBN
978-1-4244-1224-2
Type
conf
DOI
10.1109/SPI.2007.4512200
Filename
4512200
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