Title :
Characterization of flexible interconnects in mobile devices
Author :
Kotiranta, Pia ; Kelander, Ilkka ; Rouvala, Markku ; Takaneva, Jussi
Author_Institution :
Nokia Res. Center, Helsinki
Abstract :
Mobile device application interface specifications have reached the data speed of gigabit per second per differential lane. Together with increased component density, miniaturization, multi-part devices, and increased signaling frequencies overlapping RF bands, the prediction of interface and system level behavior in terms of signal integrity becomes more and more complicated. This paper concentrates on signal quality studies of a gigabit-speed digital serial interface. The test system is implemented considering a mobile device with moving parts, and corresponding simulation models are built using various simulation tools. The study discusses the correlation between measured and simulated results, adducing also the modeling feasibility of the test system.
Keywords :
flexible electronics; integrated circuit interconnections; mobile communication; digital serial interface; flexible interconnects; interface specifications; miniaturization; mobile device; multipart devices; signal integrity; signal quality; Bandwidth; Displays; Flexible printed circuits; Power system modeling; Protocols; RF signals; Standards development; System testing; Test equipment; Transmission line measurements;
Conference_Titel :
Signal Propagation on Interconnects, 2007. SPI 2007. IEEE Workshop on
Conference_Location :
Genova
Print_ISBN :
978-1-4244-1223-5
Electronic_ISBN :
978-1-4244-1224-2
DOI :
10.1109/SPI.2007.4512225