Fundamentals of a 3-D “snowball” model for surface roughness power losses

Author

Huray, P.G. ; Hall, Stephen ; Pytel, Steven ; Oluwafemi, Femi ; Mellitz, Richard ; Hua, Daniel ; Ye, Peng

Author_Institution

Dept. of Electr. Eng., Univ. of South Carolina, Columbia, SC

fYear

2007

fDate

13-16 May 2007

Firstpage

121

Lastpage

124

Abstract

SEM photographs of a typical copper conductors prepared by the PCB industry exhibit a 3-D "snowball" structure of copper surface distortions. We have developed an analytical basis for the electromagnetic scattering by the copper "snowballs" to predict additional power losses to those presented by the propagating medium that compare well with the observed measurements for a set of rough microstrip lines. In this paper we describe the fundamental concepts involved with the 3D scattering theory of our analysis.

Keywords

conducting materials; copper; electromagnetic wave propagation; electromagnetic wave scattering; electronics industry; losses; microstrip lines; printed circuit manufacture; scanning electron microscopy; surface roughness; 3D snowball model fundamentals; PCB industry; SEM photographs; copper surface distortions; electromagnetic scattering; rough microstrip lines; surface roughness power losses; typical copper conductors preparation; Conductors; Copper; Distortion measurement; Electromagnetic analysis; Electromagnetic propagation; Electromagnetic scattering; Metals industry; Propagation losses; Rough surfaces; Surface roughness;

fLanguage

English

Publisher

ieee

Conference_Titel

Signal Propagation on Interconnects, 2007. SPI 2007. IEEE Workshop on

Conference_Location

Genova

Print_ISBN

978-1-4244-1223-5

Electronic_ISBN

978-1-4244-1224-2

Type

conf

DOI

10.1109/SPI.2007.4512227

Filename

4512227