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The following topics are dealt with: VLSI design and circuits; CMOS image sensor; macro-pipelined architecture; timing optimisation; high reliable digital signal processor; differential fault analysis; photoelectric encoder system; multi-standard decoder; logic gate; high speed face detection architecture; power management IC; current mode DC-DC converter; CMOS low-dropout; analogue technique; class-AB CMOS buffer; fully differential amplifier; double charge pump circuit; CMOS charge pump; signal conditioner IC; EEG-ECG signal recording applications; chip multiprocessor; VHDL and system Verilog; high speed CMOS image; homogeneous multiprocessor system-on-chip; quartz crystal microbalance biosensors; NoC-based multicore architecture; wireless communications; robust frame synchronisation; high-efficiect baseband transceiver; test, reliability, and fault tolerance; NAND flash memories; SRAM weak cell testing; immune latch circuit design; electrostatic discharge protection; silicon nanowire technology; software-hardware co-debug platform; GGnMOS ESD protection device; memristor logic, and resistive memory; phase change memory; multidielectric Green function; three-dimensional network-on-chip; low-leakage flip-flop FPGA emulation; dual-output basic logic element; high speed ASIC design; mixed polarity Reed-Muller expression; annealing genetic algorithm; MEMS technology, device, and circuit; buck DC-DC converter; power HEMT; MEMS gyroscope drive; inductorless CMOS LNA; second-order temperature compensation; current source inverter structure; low-kickback preamplifier; large-signal MOSFET modelling; pipelined ADC; wireless transceiver and building blocks; wireless sensor network; reconfigurable low pass filter; and embedded system.