Title :
Effect of lead length on the response of ESD protection devices
Author :
Fallah, Ahmad M. ; Nelson, Robert M.
Author_Institution :
Phoenix Int., Fargo, ND, USA
Abstract :
One method of protecting electronic components from the effects of ESD is to shunt the ESD current to ground. The response of the protection devices can be affected, however, by parasitic components in the component structure, as well as board parasitics such as the inductance of the traces and connectors to which the protective device is connected to. The effect of component lead length is investigated in this work for four components: a 100-Ω film resistor, a 33-V MOV, and two unidirectional TVS diodes. Up to 15.6 dB additional attenuation is provided by shortening the leads of the protection device
Keywords :
earthing; electronic equipment testing; electrostatic discharge; inductance; protection; 100 ohm; 33 V; ESD protection devices; board parasitics; component lead length; component structure; connectors; electronic components; inductance; parasitic components; resistor; response; traces; unidirectional TVS diodes; Current measurement; Electrostatic discharge; Humans; IEC standards; Lead compounds; Probes; Protection; Resistors; Testing; Wire;
Conference_Titel :
Electromagnetic Compatibility, 1999 IEEE International Symposium on
Conference_Location :
Seattle, WA
Print_ISBN :
0-7803-5057-X
DOI :
10.1109/ISEMC.1999.810202
