DocumentCode
3379104
Title
Si3 N4 extrinsic defects and capacitor reliability
Author
Scarpulla, John ; King, Everett E. ; Osborn, Jon V.
Author_Institution
Electron. & Photonics Lab., Aerosp. Corp., El Segundo, CA, USA
fYear
2011
fDate
10-14 April 2011
Abstract
The capacitors implemented in RF/microwave MMICs seem to dominate the reliability in many cases, rather than the active devices (pHEMTs or HBTs) themselves. We have examined MIMCAP extrinsic defect density by extracting it from published data available in the open literature. The methodology for extracting defect densities from probability plots of times to breakdown or of ramped breakdown voltages is shown. We have noted that the extrinsic densities are quite varied across the dozen sets of data compiled. We also contributed data using Hg-dot-formed capacitors. Using this industry-wide data we provide some design charts for the sizing of capacitors in MMICs based upon their extrinsic reliability.
Keywords
MMIC; capacitors; integrated circuit reliability; silicon compounds; Hg-dot- formed capacitor; MIMCAP extrinsic defect density; RF-microwave MMIC; Si3N4; capacitor reliability; industry-wide data; probability plot; ramped breakdown voltage; Breakdown voltage; Capacitors; Electric breakdown; Films; MMICs; Reliability; Defect Desity; Dielectric Reliability; Effective Thickness; Extrinxic Defects; GaAs MMIC; MIMCAP; Silicon Nitride; TDDB;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium (IRPS), 2011 IEEE International
Conference_Location
Monterey, CA
ISSN
1541-7026
Print_ISBN
978-1-4244-9113-1
Electronic_ISBN
1541-7026
Type
conf
DOI
10.1109/IRPS.2011.5784456
Filename
5784456
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