• DocumentCode
    3379104
  • Title

    Si3N4 extrinsic defects and capacitor reliability

  • Author

    Scarpulla, John ; King, Everett E. ; Osborn, Jon V.

  • Author_Institution
    Electron. & Photonics Lab., Aerosp. Corp., El Segundo, CA, USA
  • fYear
    2011
  • fDate
    10-14 April 2011
  • Abstract
    The capacitors implemented in RF/microwave MMICs seem to dominate the reliability in many cases, rather than the active devices (pHEMTs or HBTs) themselves. We have examined MIMCAP extrinsic defect density by extracting it from published data available in the open literature. The methodology for extracting defect densities from probability plots of times to breakdown or of ramped breakdown voltages is shown. We have noted that the extrinsic densities are quite varied across the dozen sets of data compiled. We also contributed data using Hg-dot-formed capacitors. Using this industry-wide data we provide some design charts for the sizing of capacitors in MMICs based upon their extrinsic reliability.
  • Keywords
    MMIC; capacitors; integrated circuit reliability; silicon compounds; Hg-dot- formed capacitor; MIMCAP extrinsic defect density; RF-microwave MMIC; Si3N4; capacitor reliability; industry-wide data; probability plot; ramped breakdown voltage; Breakdown voltage; Capacitors; Electric breakdown; Films; MMICs; Reliability; Defect Desity; Dielectric Reliability; Effective Thickness; Extrinxic Defects; GaAs MMIC; MIMCAP; Silicon Nitride; TDDB;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium (IRPS), 2011 IEEE International
  • Conference_Location
    Monterey, CA
  • ISSN
    1541-7026
  • Print_ISBN
    978-1-4244-9113-1
  • Electronic_ISBN
    1541-7026
  • Type

    conf

  • DOI
    10.1109/IRPS.2011.5784456
  • Filename
    5784456