Title :
The DARPA COmpound Semiconductor Materials On Silicon (COSMOS) Program
Author :
Rosker, Mark J. ; Greanya, Viktoria ; Chang, Tsu-Hsi
Author_Institution :
Defense Adv. Res. Projects Agency, Arlington, VA
Abstract :
The DARPA COmpound semiconductor materials on silicon (COSMOS) program is developing processes to enable transistor-scale heterogeneous integration of advanced compound semiconductor (CS) devices with state of the art silicon circuits. The approaches to achieve this program goal include micro assembly, monolithic epitaxial growth, and epitaxy layer bonding processes. In Phase I of the program, performers have demonstrated high quality selective growth of CS materials on CMOS wafers, as well as successful heterogeneous integration of InP heterojunction bipolar transistors (HBT) with commercially fabricated complementary-metal-oxide- semiconductor (CMOS) transistors and demonstrated a fully functional heterogeneous differential amplifier circuit. This paper will review the program goals, discuss its implications, and present recent results.
Keywords :
CMOS integrated circuits; differential amplifiers; epitaxial growth; heterojunction bipolar transistors; microassembling; military systems; semiconductor technology; CMOS wafer; COSMOS program; DARPA; advanced compound semiconductor devices; complementary-metal-oxide- semiconductor transistors; compound semiconductor materials; differential amplifier circuit; epitaxy layer bonding process; heterojunction bipolar transistors; microassembly; monolithic epitaxial growth; silicon circuits; transistor-scale heterogeneous integration; CMOS process; CMOS technology; Heterojunction bipolar transistors; III-V semiconductor materials; Integrated circuit interconnections; Integrated circuit technology; Integrated circuit yield; Photonic band gap; Semiconductor materials; Silicon;
Conference_Titel :
Compound Semiconductor Integrated Circuits Symposium, 2008. CSIC '08. IEEE
Conference_Location :
Monterey, CA
Print_ISBN :
978-1-4244-1939-5
Electronic_ISBN :
1550-8781
DOI :
10.1109/CSICS.2008.6