DocumentCode
3379707
Title
Application based reliability assessment and qualification methodology for medical ICs
Author
Zhu, Xiaowei ; Vasanth, Karthik ; Xu, Xiaochen ; Smyth, Charles ; Rhoton, Brent
Author_Institution
High Performance Analog, Med./HiRel Bus. Group, Texas Instrum., Dallas, TX, USA
fYear
2011
fDate
10-14 April 2011
Abstract
Reliability assessment and qualification system has strong economic implications for both manufacturers and customers. The best system should have a good balance among cost of verification, market timing requirement, and acceptable risk that meets the targeted user´s application conditions and requirements. With the increasing use of innovative electronics in the medical applications, it becomes difficult to have a single reliability assessment and qualification approach to serve all applications. In this paper, we review the existing reliability assessment and qualification framework, and discuss their applicability in medical ICs. We will discuss the tradeoff and challenges in defining reliable medical IC products based on the application demands using a couple of medical IC examples.
Keywords
biomedical electronics; biomedical ultrasonics; semiconductor device reliability; innovative electronics; market timing requirement; medical IC; qualification methodology; reliability assessment; ultrasound; Acceleration; Biomedical imaging; Qualifications; Reliability; Temperature; Temperature measurement; Ultrasonic imaging; aging; medical IC; qualification; reliability assessment; ultrasound;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium (IRPS), 2011 IEEE International
Conference_Location
Monterey, CA
ISSN
1541-7026
Print_ISBN
978-1-4244-9113-1
Electronic_ISBN
1541-7026
Type
conf
DOI
10.1109/IRPS.2011.5784482
Filename
5784482
Link To Document