DocumentCode
3379745
Title
Implications of waveform and thickness dependence of SiO2 breakdown on accelerated testing
Author
Rosenbaum, E. ; Moazzami, R. ; Hu, C.
Author_Institution
Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
fYear
1991
fDate
22-24 May 1991
Firstpage
214
Lastpage
218
Abstract
Oxide breakdown characteristics under accelerated test conditions are different from those under normal operating conditions. While oxide lifetime under unipolar pulse stress is roughly equal to the DC lifetime multiplied by the reciprocal of the duty cycle, lifetime under bipolar pulse stress is extended by an additional factor of 40 or more. At the high electric fields used during accelerated testing, oxides with thickness greater than 15 nm suffer lifetime degradation which may be attributed to hole trapping. This will lead to overly conservative projections of lifetime under normal operating conditions
Keywords
hole traps; impulse testing; insulating thin films; life testing; silicon compounds; DC lifetime; SiO2; accelerated test conditions; accelerated testing; bipolar pulse stress; duty cycle; hole trapping; lifetime degradation; operating conditions; oxide breakdown; oxide lifetime; thickness dependence; unipolar pulse stress; Breakdown voltage; Capacitors; Degradation; Dielectric breakdown; Electric breakdown; Life estimation; Life testing; Predictive models; Q measurement; Stress;
fLanguage
English
Publisher
ieee
Conference_Titel
VLSI Technology, Systems, and Applications, 1991. Proceedings of Technical Papers, 1991 International Symposium on
Conference_Location
Taipei
ISSN
1524-766X
Print_ISBN
0-7803-0036-X
Type
conf
DOI
10.1109/VTSA.1991.246679
Filename
246679
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