• DocumentCode
    3379745
  • Title

    Implications of waveform and thickness dependence of SiO2 breakdown on accelerated testing

  • Author

    Rosenbaum, E. ; Moazzami, R. ; Hu, C.

  • Author_Institution
    Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
  • fYear
    1991
  • fDate
    22-24 May 1991
  • Firstpage
    214
  • Lastpage
    218
  • Abstract
    Oxide breakdown characteristics under accelerated test conditions are different from those under normal operating conditions. While oxide lifetime under unipolar pulse stress is roughly equal to the DC lifetime multiplied by the reciprocal of the duty cycle, lifetime under bipolar pulse stress is extended by an additional factor of 40 or more. At the high electric fields used during accelerated testing, oxides with thickness greater than 15 nm suffer lifetime degradation which may be attributed to hole trapping. This will lead to overly conservative projections of lifetime under normal operating conditions
  • Keywords
    hole traps; impulse testing; insulating thin films; life testing; silicon compounds; DC lifetime; SiO2; accelerated test conditions; accelerated testing; bipolar pulse stress; duty cycle; hole trapping; lifetime degradation; operating conditions; oxide breakdown; oxide lifetime; thickness dependence; unipolar pulse stress; Breakdown voltage; Capacitors; Degradation; Dielectric breakdown; Electric breakdown; Life estimation; Life testing; Predictive models; Q measurement; Stress;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI Technology, Systems, and Applications, 1991. Proceedings of Technical Papers, 1991 International Symposium on
  • Conference_Location
    Taipei
  • ISSN
    1524-766X
  • Print_ISBN
    0-7803-0036-X
  • Type

    conf

  • DOI
    10.1109/VTSA.1991.246679
  • Filename
    246679