Title :
Time evolution of electrical degradation under high-voltage stress in GaN high electron mobility transistors
Author :
Joh, Jungwoo ; del Alamo, Jesús A.
Author_Institution :
Microsyst. Technol. Labs., Massachusetts Inst. of Technol., Cambridge, MA, USA
Abstract :
In this work, we investigate the time evolution of electrical degradation of GaN high electron mobility transistors under high voltage stress in the OFF state. We found that the gate current starts to degrade first, followed by degradation in current collapse and eventually permanent degradation in ID. We also found that the time evolution of gate current degradation is unaffected by temperature, while drain current degradation is thermally accelerated.
Keywords :
III-V semiconductors; gallium compounds; high electron mobility transistors; wide band gap semiconductors; GaN; current collapse; drain current degradation; electrical degradation; gate current; high electron mobility transistors; high-voltage stress; permanent degradation; time evolution; Charge carrier processes; Degradation; Gallium nitride; HEMTs; Logic gates; MODFETs; Stress; GaN; HEMT; degradation; reliability; time evolution;
Conference_Titel :
Reliability Physics Symposium (IRPS), 2011 IEEE International
Conference_Location :
Monterey, CA
Print_ISBN :
978-1-4244-9113-1
Electronic_ISBN :
1541-7026
DOI :
10.1109/IRPS.2011.5784511