DocumentCode
3380335
Title
Time evolution of electrical degradation under high-voltage stress in GaN high electron mobility transistors
Author
Joh, Jungwoo ; del Alamo, Jesús A.
Author_Institution
Microsyst. Technol. Labs., Massachusetts Inst. of Technol., Cambridge, MA, USA
fYear
2011
fDate
10-14 April 2011
Abstract
In this work, we investigate the time evolution of electrical degradation of GaN high electron mobility transistors under high voltage stress in the OFF state. We found that the gate current starts to degrade first, followed by degradation in current collapse and eventually permanent degradation in ID. We also found that the time evolution of gate current degradation is unaffected by temperature, while drain current degradation is thermally accelerated.
Keywords
III-V semiconductors; gallium compounds; high electron mobility transistors; wide band gap semiconductors; GaN; current collapse; drain current degradation; electrical degradation; gate current; high electron mobility transistors; high-voltage stress; permanent degradation; time evolution; Charge carrier processes; Degradation; Gallium nitride; HEMTs; Logic gates; MODFETs; Stress; GaN; HEMT; degradation; reliability; time evolution;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium (IRPS), 2011 IEEE International
Conference_Location
Monterey, CA
ISSN
1541-7026
Print_ISBN
978-1-4244-9113-1
Electronic_ISBN
1541-7026
Type
conf
DOI
10.1109/IRPS.2011.5784511
Filename
5784511
Link To Document