• DocumentCode
    3380335
  • Title

    Time evolution of electrical degradation under high-voltage stress in GaN high electron mobility transistors

  • Author

    Joh, Jungwoo ; del Alamo, Jesús A.

  • Author_Institution
    Microsyst. Technol. Labs., Massachusetts Inst. of Technol., Cambridge, MA, USA
  • fYear
    2011
  • fDate
    10-14 April 2011
  • Abstract
    In this work, we investigate the time evolution of electrical degradation of GaN high electron mobility transistors under high voltage stress in the OFF state. We found that the gate current starts to degrade first, followed by degradation in current collapse and eventually permanent degradation in ID. We also found that the time evolution of gate current degradation is unaffected by temperature, while drain current degradation is thermally accelerated.
  • Keywords
    III-V semiconductors; gallium compounds; high electron mobility transistors; wide band gap semiconductors; GaN; current collapse; drain current degradation; electrical degradation; gate current; high electron mobility transistors; high-voltage stress; permanent degradation; time evolution; Charge carrier processes; Degradation; Gallium nitride; HEMTs; Logic gates; MODFETs; Stress; GaN; HEMT; degradation; reliability; time evolution;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium (IRPS), 2011 IEEE International
  • Conference_Location
    Monterey, CA
  • ISSN
    1541-7026
  • Print_ISBN
    978-1-4244-9113-1
  • Electronic_ISBN
    1541-7026
  • Type

    conf

  • DOI
    10.1109/IRPS.2011.5784511
  • Filename
    5784511