Fully Dry 2D and 3D Self-Assembly with Interlocking Pin Fasteners

This paper presents a novel method for fully dry, 2D and 3D self-assembly of silicon parts by implementing interlocking structures. The assembly parts have interlocking pins similar to a nail, whereas the corresponding substrate has binding sites with interlock holes that guide the interlocking pins to the fastened positions. These interlocking features are fabricated by a series of silicon deep RIE, sidewall passivation film coating and isotropic silicon RIE. Test results show 100% assembly on the substrate with 18% packing density, and 81% on the substrate with 40% packing density. These assembly rates are achieved with much less use of excessive parts compared to fluid-based self-assembly processes.