• DocumentCode
    338072
  • Title

    Nondestructive evaluation of defect in optically opaque material by polyvinylidene difluoride film sensor

  • Author

    Minamide, A. ; Tokunaga, Y.

  • Author_Institution
    Dept. of Electr. Eng., Kanazawa Tech. Coll., Ishikawa, Japan
  • Volume
    1
  • fYear
    1998
  • fDate
    1998
  • Firstpage
    865
  • Abstract
    In this paper, we propose an one-dimensional model to analyze a photopyroelectric signal of optically opaque materials measured by a polyvinylidene difluoride (PVDF) film sensor in a thermal wave microscope. This model considers three layers (sample, air gap and the PVDF film) and the reflections of the thermal wave at the interfaces of each layer. In order to check the validity of the proposed model, we measure the inclination of the frequency dependence of the signal measured by the PVDF film and compare it with a theoretical value. When laser light is irradiated onto a graphite surface on the PVDF film, the measured inclinations are -1.6 for a 9 μ m PVDF film, -1.8 for a 28 μ m film and -2.0 for a 110 μ m film. These inclinations were comparable with the theoretical inclinations in the cases of all the film thickness of the PVDF film considered. In addition, we describe an artificially internal hole which assume to be a defect in the graphite sample can be evaluated using PVDF film sensor
  • Keywords
    nondestructive testing; photothermal effects; polymer films; pyroelectric detectors; signal processing; transparency; 110 mum; 28 mum; 9 mum; C; PVDF film sensor; defect; film sensor; frequency dependence; graphite sample; graphite surface; inclination; internal hole; laser light; one-dimensional model; optically opaque material; photopyroelectric signal; polyvinylidene difluoride film sensor; thermal wave microscope; Frequency dependence; Frequency measurement; Laser modes; Optical films; Optical materials; Optical microscopy; Optical reflection; Optical sensors; Signal analysis; Thermal sensors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics Symposium, 1998. Proceedings., 1998 IEEE
  • Conference_Location
    Sendai
  • ISSN
    1051-0117
  • Print_ISBN
    0-7803-4095-7
  • Type

    conf

  • DOI
    10.1109/ULTSYM.1998.762280
  • Filename
    762280