DocumentCode :
338072
Title :
Nondestructive evaluation of defect in optically opaque material by polyvinylidene difluoride film sensor
Author :
Minamide, A. ; Tokunaga, Y.
Author_Institution :
Dept. of Electr. Eng., Kanazawa Tech. Coll., Ishikawa, Japan
Volume :
1
fYear :
1998
fDate :
1998
Firstpage :
865
Abstract :
In this paper, we propose an one-dimensional model to analyze a photopyroelectric signal of optically opaque materials measured by a polyvinylidene difluoride (PVDF) film sensor in a thermal wave microscope. This model considers three layers (sample, air gap and the PVDF film) and the reflections of the thermal wave at the interfaces of each layer. In order to check the validity of the proposed model, we measure the inclination of the frequency dependence of the signal measured by the PVDF film and compare it with a theoretical value. When laser light is irradiated onto a graphite surface on the PVDF film, the measured inclinations are -1.6 for a 9 μ m PVDF film, -1.8 for a 28 μ m film and -2.0 for a 110 μ m film. These inclinations were comparable with the theoretical inclinations in the cases of all the film thickness of the PVDF film considered. In addition, we describe an artificially internal hole which assume to be a defect in the graphite sample can be evaluated using PVDF film sensor
Keywords :
nondestructive testing; photothermal effects; polymer films; pyroelectric detectors; signal processing; transparency; 110 mum; 28 mum; 9 mum; C; PVDF film sensor; defect; film sensor; frequency dependence; graphite sample; graphite surface; inclination; internal hole; laser light; one-dimensional model; optically opaque material; photopyroelectric signal; polyvinylidene difluoride film sensor; thermal wave microscope; Frequency dependence; Frequency measurement; Laser modes; Optical films; Optical materials; Optical microscopy; Optical reflection; Optical sensors; Signal analysis; Thermal sensors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Ultrasonics Symposium, 1998. Proceedings., 1998 IEEE
Conference_Location :
Sendai
ISSN :
1051-0117
Print_ISBN :
0-7803-4095-7
Type :
conf
DOI :
10.1109/ULTSYM.1998.762280
Filename :
762280
Link To Document :
بازگشت