Title :
S-parameter analysis of flip-chip transitions
Author :
Vahldieck, R. ; Jin, H.
Author_Institution :
Dept. of Electr. & Comput. Eng., Victoria Univ., BC, Canada
Abstract :
Flip-chip interconnections are attractive for high density packaging of MMIC and optoelectronic modules. In this paper we investigate the electrical performance of flip-chip transitions between two coplanar waveguides in the presence of a short-circuited ground plane of either the CPW on the motherboard side or on the chip side. The method of analysis is based on the frequency-domain TLM approach which provides a rigorous field theoretical treatment of this type of discontinuity
Keywords :
S-parameters; coplanar waveguides; flip-chip devices; frequency-domain analysis; integrated circuit interconnections; integrated circuit packaging; transmission line matrix methods; waveguide discontinuities; MMIC; S-parameter analysis; coplanar waveguides; discontinuity; electrical performance; flip-chip transitions; frequency-domain TLM; high density packaging; interconnections; optoelectronic modules; short-circuited ground plane; Bonding; Conductors; Coplanar waveguides; Fourier transforms; Frequency domain analysis; Integrated circuit interconnections; Microstrip; Printed circuits; Scattering parameters; Wires;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1995
Conference_Location :
Portland, OR
Print_ISBN :
0-7803-3034-X
DOI :
10.1109/EPEP.1995.524886
