• DocumentCode
    3383512
  • Title

    High throughput area-efficient SoC-based forward/inverse integer transforms for H.264/AVC

  • Author

    Do, Trang T T ; Le, Thinh M.

  • Author_Institution
    Dept. of ECE, Nat. Univ. of Singapore, Singapore, Singapore
  • fYear
    2010
  • fDate
    May 30 2010-June 2 2010
  • Firstpage
    4113
  • Lastpage
    4116
  • Abstract
    In this paper, high throughput area-efficient system-on-chip-based (SoC) forward/inverse integer transform (FIT/IIT) modules for H.264/AVC are proposed. High throughput can be achieved by pipelining quantization/rescaling and FIT/IIT blocks; while efficient area is possible by reusing architecture of all four transforms and using buffers for smoothening multiplications and reducing the number of multipliers and quantization/rescaling hardware. With the support of an Application Specific Instruction Processor (ASIP) and 2 built-in-RAM DMACs, the proposed FIT/IIT modules can perform both 4×4 and 8×8 transforms, and 2×2 and 4×4 Hadamard transforms of DC coefficients. Compared to the reported designs in 0.18 μm technology, the proposed FIT and IIT modules score higher Data Throughput per Unit Area (DTUA), and operate on each 8×8 block including I/O in 8 cycles, at 162.1 and 230.9 MHz, respectively.
  • Keywords
    Hadamard transforms; random-access storage; system-on-chip; video coding; ASIP; DTUA; FIT-IIT modules; H.264-AVC; Hadamard transforms; application specific instruction processor; built-in-RAM DMAC; data throughput per unit area; forward-inverse integer transforms; frequency 162.1 MHz; frequency 230.9 MHz; high-throughput area-efficient SoC; pipelining quantization; smoothening multiplications; system-on-chip; Application specific processors; Automatic voltage control; Circuit simulation; Circuit synthesis; Discrete transforms; Hardware; Pipeline processing; Quantization; Throughput; Video compression;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Circuits and Systems (ISCAS), Proceedings of 2010 IEEE International Symposium on
  • Conference_Location
    Paris
  • Print_ISBN
    978-1-4244-5308-5
  • Electronic_ISBN
    978-1-4244-5309-2
  • Type

    conf

  • DOI
    10.1109/ISCAS.2010.5537614
  • Filename
    5537614