• DocumentCode
    3384792
  • Title

    Routability-driven RDL routing with pin reassignment

  • Author

    Yan, Jin-Tai ; Chen, Ke-Chyuan ; Chen, Zhi-Wei

  • Author_Institution
    Dept. of Comput. Sci. & Inf. Eng., Chung-Hua Univ., Hsinchu, Taiwan
  • fYear
    2010
  • fDate
    27-29 Sept. 2010
  • Firstpage
    133
  • Lastpage
    138
  • Abstract
    Due to the infeasible pre-assignment of IO connections in a flip-chip design, all the published RDL routers cannot guarantee 100% routability for the pre-assigned IO connections. In this paper, based on two swapping processes for pin reassignment, the unroutable conditions in a flip-chip design can be eliminated. Furthermore, by using the assignment of routability-driven transfer and boundary pins, a given set of pre-assigned IO connections between the wire-bonding pads and the bump balls can be completely routed to minimize the total wirelength with 100% routability in a flip-chip design.
  • Keywords
    flip-chip devices; integrated circuit design; lead bonding; RDL routers; boundary pins; bump balls; flip-chip design; pin reassignment; pre-assigned IO connections; redistribution layer; routability-driven RDL routing; routability-driven transfer; swapping processes; unroutable conditions; wire-bonding pads; Arrays; Bonding; Pins; Routing; Sorting; Wires;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    SOC Conference (SOCC), 2010 IEEE International
  • Conference_Location
    Las Vegas, NV
  • ISSN
    Pending
  • Print_ISBN
    978-1-4244-6682-5
  • Type

    conf

  • DOI
    10.1109/SOCC.2010.5784746
  • Filename
    5784746