DocumentCode
3384882
Title
Simulation of discharge development in SF6 and SF6 -mixtures for homogeneous and inhomogeneous field distribution
Author
Pfeiffer, W. ; Welke, H.
Author_Institution
Tech. Hochschule, Darmstadt, Germany
fYear
1992
fDate
7-10 Jun 1992
Firstpage
336
Lastpage
339
Abstract
A model has been developed for the simulation of electrical breakdown phenomena in compressed gaseous dielectrics taking into account electron-neutral-gas collisions and collective interactions among charged particles. Elastic, exciting, ionizing and attaching collisions between electrons and neutral gas molecules are included using a Monte Carlo technique. Space charge effects are considered by solving Poisson´s equation for one dimension and two dimensions. A method is presented for simulating the predischarge development in multicomponent gas mixtures. Using this model, it is possible to analyze the effect of corona stabilization under impulse voltage stress. The ionization and attachment coefficients are determined by directly solving the Boltzmann equation
Keywords
Monte Carlo methods; corona; electric breakdown of gases; electron attachment; gas mixtures; gaseous insulation; ionisation of gases; molecular electron impact ionisation; sulphur compounds; transients; Boltzmann equation; Monte Carlo technique; Poisson´s equation; SF6; attaching collisions; collective interactions; compressed gaseous dielectrics; discharge development; effect of corona stabilization; elastic collisions; electrical breakdown phenomena; electron-neutral-gas collisions; exciting collisions; homogeneous field distribution; impulse voltage stress; inhomogeneous field distribution; ionizing collisions; model; multicomponent gas mixtures; predischarge development; simulation; space charge effects; Corona; Dielectric breakdown; Electric breakdown; Electrons; Joining processes; Monte Carlo methods; Poisson equations; Space charge; Stress; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Insulation, Conference Record of the 1992 IEEE International Symposium on
Conference_Location
Baltimore, MD
ISSN
1089-084X
Print_ISBN
0-7803-0649-X
Type
conf
DOI
10.1109/ELINSL.1992.246987
Filename
246987
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