• DocumentCode
    3385151
  • Title

    On virtual prototyping of embedded system-on-chips

  • Author

    Ni, Yi ; Mong, Wai Sum ; Zhu, Jianwen

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Univ. of Toronto, Toronto, ON, Canada
  • fYear
    2011
  • fDate
    25-28 Oct. 2011
  • Firstpage
    1106
  • Lastpage
    1109
  • Abstract
    With continuous advancement in silicon technology and high feature demands on consumer electronics such as smartphones, embedded software stacks are becoming more complex and start to overtake hardware content in development cost. Virtual Prototyping addresses the software complexity challenge by enabling early software development before hardware arrival using a variety of simulation and emulation techniques. This article reviews the current industrial practices on silicon virtual prototyping, identifies their challenges and calls for new ways to tackle them.
  • Keywords
    consumer electronics; elemental semiconductors; hardware-software codesign; silicon; system-on-chip; virtual prototyping; Si; consumer electronics; embedded software stacks; embedded system-on-chips; industrial practices; silicon virtual prototyping; smartphones; software development; Mobile communication; Software;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    ASIC (ASICON), 2011 IEEE 9th International Conference on
  • Conference_Location
    Xiamen
  • ISSN
    2162-7541
  • Print_ISBN
    978-1-61284-192-2
  • Electronic_ISBN
    2162-7541
  • Type

    conf

  • DOI
    10.1109/ASICON.2011.6157402
  • Filename
    6157402