DocumentCode :
3385732
Title :
The influence of copper contamination on gate oxide integrity
Author :
Vermeire, B. ; Parks, H.G.
Author_Institution :
Dept. of Electr. & Comput. Eng., Arizona Univ., Tucson, AZ, USA
fYear :
1997
fDate :
10-12 Sep 1997
Firstpage :
30
Lastpage :
32
Abstract :
It is shown that low levels of copper contamination present on pre-oxidation silicon surfaces significantly affect not only the area, but also the field overlap defect density of the gate oxide. The gate oxide yield loss associated with the field overlap defects will dominate in circuits with device dimensions below 10 μm
Keywords :
copper; elemental semiconductors; oxidation; silicon; surface contamination; 10 micron; Cu; Si; area; copper contamination; field overlap defect density; gate oxide integrity; silicon surface; yield; Atomic measurements; Breakdown voltage; Capacitors; Copper; MOS devices; Oxidation; Poisson equations; Pollution measurement; Silicon; Surface contamination;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Advanced Semiconductor Manufacturing Conference and Workshop, 1997. IEEE/SEMI
Conference_Location :
Cambridge, MA
ISSN :
1078-8743
Print_ISBN :
0-7803-4050-7
Type :
conf
DOI :
10.1109/ASMC.1997.630700
Filename :
630700
Link To Document :
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