• DocumentCode
    3386924
  • Title

    Evaluating service oriented architectures (SOA) in pervasive computing

  • Author

    Kalasapur, Swaroop ; Kumar, Mohan ; Shirazi, Behrooz

  • Author_Institution
    Dept. of Comput. Sci. Eng., Texas Univ., Arlington, TX
  • fYear
    2006
  • fDate
    13-17 March 2006
  • Lastpage
    285
  • Abstract
    Increasing popularity of the pervasive computing paradigm on one hand and the technological developments on the other, have paved the way for development and deployment of pervasive services in the everyday habitat. The service providers, who build, operate and manage services would want to maximize their revenues, and at the same time, the users would seek guarantees to support their applications. While there are a number of mechanisms proposed to build and operate service oriented architectures (SOAs) in pervasive computing arena, very little work has been done in terms of evaluating such schemes. The work presented in this paper proposes mechanisms to evaluate SOAs in pervasive computing. We also present a mechanism to evaluate service composition techniques, which are an effective way of delivering services to the end user. In earlier work, we proposed a service composition mechanism in pervasive computing environments called seamless service composition (SeSCo). We evaluate and compare SeSCo with a discover+match mechanism for the deployment of pervasive services within an automobile. We also present performance results of the two approaches through simulation
  • Keywords
    open systems; ubiquitous computing; SOA; SeSCo; discover-match mechanism; pervasive computing; seamless service composition; service composition technique; service oriented architecture; Automobile manufacture; Computational modeling; Computer architecture; Costs; Fabrics; Hospitals; Pervasive computing; Service oriented architecture; Smart homes; Virtual manufacturing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Pervasive Computing and Communications, 2006. PerCom 2006. Fourth Annual IEEE International Conference on
  • Conference_Location
    Pisa
  • Print_ISBN
    0-7695-2518-0
  • Type

    conf

  • DOI
    10.1109/PERCOM.2006.24
  • Filename
    1604819