DocumentCode
3387288
Title
A systematic leakage current analysis of gate oxide soft breakdown
Author
Reiner, Joachim C.
Author_Institution
EMPA Dept. Electron., Metrol. Reliability Centre, Dubendorf, Switzerland
fYear
2002
fDate
21-24 Oct. 2002
Firstpage
196
Lastpage
198
Abstract
Soft breakdown is a breakdown mechanism observed for gate oxide layer thickness of 7 nm and less. The physical origin of this new reliability issue is still under debate. The results presented here show that most of the preand post-breakdown leakage current phenomena can be observed on the same sample. This indicates that the breakdown of a thin gate oxide is a complex process. The leakage current bursts observed before the (soft) breakdown event might be used as pre-breakdown trigger signal possibly allowing the study of the weak spot before its destruction by the breakdown event.
Keywords
electric breakdown; leakage currents; reliability; gate oxide; leakage current; reliability; soft breakdown; CMOS technology; Degradation; Electric breakdown; Electron traps; Fluctuations; Leakage current; MOSFET circuits; Modems; Physics; Stress;
fLanguage
English
Publisher
ieee
Conference_Titel
Integrated Reliability Workshop Final Report, 2002. IEEE International
Print_ISBN
0-7803-7558-0
Type
conf
DOI
10.1109/IRWS.2002.1194267
Filename
1194267
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