• DocumentCode
    3387288
  • Title

    A systematic leakage current analysis of gate oxide soft breakdown

  • Author

    Reiner, Joachim C.

  • Author_Institution
    EMPA Dept. Electron., Metrol. Reliability Centre, Dubendorf, Switzerland
  • fYear
    2002
  • fDate
    21-24 Oct. 2002
  • Firstpage
    196
  • Lastpage
    198
  • Abstract
    Soft breakdown is a breakdown mechanism observed for gate oxide layer thickness of 7 nm and less. The physical origin of this new reliability issue is still under debate. The results presented here show that most of the preand post-breakdown leakage current phenomena can be observed on the same sample. This indicates that the breakdown of a thin gate oxide is a complex process. The leakage current bursts observed before the (soft) breakdown event might be used as pre-breakdown trigger signal possibly allowing the study of the weak spot before its destruction by the breakdown event.
  • Keywords
    electric breakdown; leakage currents; reliability; gate oxide; leakage current; reliability; soft breakdown; CMOS technology; Degradation; Electric breakdown; Electron traps; Fluctuations; Leakage current; MOSFET circuits; Modems; Physics; Stress;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Integrated Reliability Workshop Final Report, 2002. IEEE International
  • Print_ISBN
    0-7803-7558-0
  • Type

    conf

  • DOI
    10.1109/IRWS.2002.1194267
  • Filename
    1194267