Title :
Numerical prediction of electronic component heat transfer: an industry perspective
Author :
Eveloy, Valérie ; Rodgers, Peter ; Hashmi, M.S.J
Author_Institution :
Electron. Thermal Manage. Ltd, Westport, Ireland
Abstract :
This study aims to provide a perspective on the current capabilities of computational fluids dynamics (CFD) as a design tool to predict component operating temperature in electronic systems. A systematic assessment of predictive accuracy is presented for printed circuit board (PCB) mounted component heat transfer, using a CFD code dedicated to the thermal analysis of electronic systems. Component operating temperature predictive accuracy ranges from +3°C to +22°C (up to 35%) of measurement, depending on component location on the board, airflow velocity and flow model applied. Combined with previous studies, the results highlight that component junction temperature needs to be experimentally measured when used for strategic product design decisions and reliability predictions. Potential development areas are discussed for improved analysis.
Keywords :
computational fluid dynamics; heat transfer; thermal analysis; thermal management (packaging); CFD design tool; PCB mounted component heat transfer; airflow velocity; component board location; component junction temperature measurement; component operating temperature; computational fluids dynamics; conjugate heat transfer; electronic component heat transfer numerical prediction; electronics cooling; flow modeling; reliability predictions; thermal analysis CFD code; Accuracy; Computational fluid dynamics; Electronic components; Electronics industry; Fluid flow measurement; Heat transfer; Printed circuits; Temperature dependence; Temperature distribution; Velocity measurement;
Conference_Titel :
Semiconductor Thermal Measurement and Management Symposium, 2003. Ninteenth Annual IEEE
Print_ISBN :
0-7803-7793-1
DOI :
10.1109/STHERM.2003.1194334
