• DocumentCode
    3389013
  • Title

    Ice bonding strength detection of the super-hydrophobic coating

  • Author

    Zhengyong Huang ; Yong Li ; Qian Wang ; Gaolin Wu ; Jin Fu ; Jian Li ; Xinzhu Yan ; Yonglong Yan

  • Author_Institution
    State Key Lab. of Power Transm. Equip. & Syst. Security & New Technol., Chongqing Univ., Chongqing, China
  • fYear
    2013
  • fDate
    20-23 Oct. 2013
  • Firstpage
    434
  • Lastpage
    437
  • Abstract
    The icing flashover is increasingly becoming a serious problem with the development of the extra-high voltage engineering. Reducing the bonding strength between the substrate and the ice by super-hydrophobic coating is a choice for the anti-icing. The bare insulator, RTV coated insulator and the super-hydrophobic insulator are chosen for comparing. The experimental facility is set up. The vertical bonding strength, the vertical fracture energy, the shear bonding strength and the shear fracture energy are detected after first ice glaciations and second one. Results show that bonding strength between the super-hydrophobic substrate and the ice is less than that of the RTV coated insulator and the ice. The deiced surface still shows good super-hydrophobicity and the small ice bonding strength keeps almost the same which show good prospect for the anti-icing and de-icing.
  • Keywords
    de-icing; flashover; freezing; high-voltage engineering; hydrophobicity; ice; insulating coatings; insulators; RTV coated insulator; antiicing; bare insulator; deiced surface; deicing; extra-high voltage engineering; ice bonding strength; ice glaciations; icing flashover; shear bonding strength; shear fracture energy; superhydrophobic coating; superhydrophobic insulator; superhydrophobic substrate; vertical bonding strength; vertical fracture energy; Bonding; Coatings; Glass; Ice; Insulators; Surface morphology; Surface treatment;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation and Dielectric Phenomena (CEIDP), 2013 IEEE Conference on
  • Conference_Location
    Shenzhen
  • Type

    conf

  • DOI
    10.1109/CEIDP.2013.6748156
  • Filename
    6748156