Experimental study on two-phase heat transfer in microchannel heat sinks with hotspots

Author

Cho, Eun Seok ; Koo, Jae-Mo ; Jiang, Linan ; Prasher, Ravi S. ; Kim, Min Soo ; Santiago, Juan G. ; Kenny, Thomas W. ; Goodson, Kenneth E.

Author_Institution

Sch. of Mech. & Aerosp. Eng., Seoul Nat. Univ., South Korea

fYear

2003

fDate

11-13 March 2003

Firstpage

242

Lastpage

246

Abstract

Hotspots, imposed by spatially non-uniform heat flux in a high performance circuit, increase the chip maximum junction temperature, which degrades the reliability and performance of electronic equipment. Microchannel heat sinks with two-phase convective heat transfer are effective for removing high heat flux exceeding 100 W/cm². Cross-linking of microchannels can be promising for achieving better temperature uniformity and more effective cooling due to the lateral fluid transport and mixing. This study experimentally investigates the impact of mass flow distribution on the chip temperature field in a multi-channel heat sink. Furthermore, the performance of two microchannel heat sinks is compared with different configurations: a regular microchannel heat sink and a cross-linked microchannel heat sink.

Keywords

convection; cooling; heat sinks; integrated circuit reliability; chip maximum junction temperature; cooling; cross-linked microchannel heat sink; fluid mixing; heat flux; hotspots; lateral fluid transport; mass flow distribution; microchannel heat sinks; performance degradation; reliability degradation; spatially nonuniform heat flux; temperature uniformity; two-phase convective heat transfer; Circuits; Electronic equipment; Electronics cooling; Heat sinks; Heat transfer; Materials testing; Microchannel; Plasma temperature; Temperature distribution; Transducers;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Thermal Measurement and Management Symposium, 2003. Ninteenth Annual IEEE

ISSN

1065-2221

Print_ISBN

0-7803-7793-1

Type

conf

DOI

10.1109/STHERM.2003.1194369

Filename

1194369