• DocumentCode
    3389337
  • Title

    Dynamic modeling of vortex levitation

  • Author

    Li, Xin ; Kawashima, Kenji ; Kagawa, Toshiharu

  • Author_Institution
    Tokyo Inst. of Technol., Yokohama
  • fYear
    2008
  • fDate
    10-12 Oct. 2008
  • Firstpage
    218
  • Lastpage
    224
  • Abstract
    Vortex levitation can achieve non-contact handling by blowing air into a vortex cup through a tangential nozzle to generate a swirling air flow. In this paper, its dynamic characteristics are analyzed through dynamic pressure response, and a dynamic modeling is developed and verified experimentally. First, we observe the pressure dynamic response inside the cup by making the cup and the work piece relatively move sinusoidally at various frequencies. It is found that pressure transient response is very rapid so that pressure change follows the gap thickness change very well. Moreover, the annular skirt of the vortex cup entraps a thin air layer to give rise to a pressure hysteresis due to squeeze film air damping while the work piece repeating sinusoidal movement relatively to the cup. Next, according to those experimental observations, a spring-damper model is proposed by considering the lifting force caused by swirling air flow and the resistive force related to squeeze film air damping separately. Finally, the validity of the proposed model is confirmed by comparing the experimental results and analytical results in loading processes.
  • Keywords
    vortices; air blowing; dynamic modeling; dynamic pressure response; lifting force; resistive force; spring-damper model; squeeze film air damping; swirling air flow; tangential nozzle; transient response; vortex cup; vortex levitation; Atmosphere; Cyclones; Damping; Frequency; Levitation; Production; Semiconductor device modeling; Semiconductor films; Stability; Transient response;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    System Simulation and Scientific Computing, 2008. ICSC 2008. Asia Simulation Conference - 7th International Conference on
  • Conference_Location
    Beijing
  • Print_ISBN
    978-1-4244-1786-5
  • Electronic_ISBN
    978-1-4244-1787-2
  • Type

    conf

  • DOI
    10.1109/ASC-ICSC.2008.4675358
  • Filename
    4675358