Simulating the dynamic electro-thermal behavior of power electronic circuits and systems

Author

Hefner, Allen R. ; Blackburn, David L.

Author_Institution

Semicond. Electron. Div., Nat. Inst. of Stand. & Technol., Gaithersburg, MD, USA

fYear

1992

fDate

1992

Firstpage

143

Lastpage

151

Abstract

A methodology is presented for simulating the dynamic electrothermal behavior of power electronic circuits and systems. In the approach described, the simulator simultaneously solves for the temperature distribution within the semiconductor devices, packages, and heat sinks (thermal network) along with the currents and voltages within the electrical network. The thermal network is then coupled to the electrical network through the electrothermal models for the semiconductor devices.

Keywords

circuit analysis computing; digital simulation; heat sinks; packaging; power electronics; semiconductor device models; temperature distribution; thermal analysis; circuit analysis computing; digital simulation; dynamic electrothermal behavior; heat sinks; packaging; power electronic circuits; semiconductor devices; temperature distribution; thermal analysis; Circuit simulation; Circuits and systems; Electronic packaging thermal management; Electrothermal effects; Heat sinks; Power electronics; Resistance heating; Semiconductor device packaging; Semiconductor devices; Temperature distribution;

fLanguage

English

Publisher

ieee

Conference_Titel

Computers in Power Electronics, 1992., IEEE Workshop on

Conference_Location

Berkeley, CA, USA

Print_ISBN

0-7803-0920-0

Type

conf

DOI

10.1109/CIPE.1992.247284

Filename

247284