• DocumentCode
    3389581
  • Title

    Temperature dependence of optical wavelength shift as a validation technique for pulsed laser diode array thermal modeling

  • Author

    Carter, Jason ; Snyder, David ; Reichenbaugh, Jeny

  • Author_Institution
    Electro-Opt. Center, Kittanning, PA, USA
  • fYear
    2003
  • fDate
    11-13 March 2003
  • Firstpage
    357
  • Lastpage
    363
  • Abstract
    As with any electronic device, the performance and reliability of laser diode arrays (LDAs) is a strong function of the temperature at which the array operates. However, the electrical and optical environment in which the LDA operates makes direct temperature measurements difficult. Wavelength measurements can be used as a means to deduce temperature by exploiting the linear relationship between wavelength and laser diode operating temperature. The process by which wavelength measurements are translated into temperature is discussed and experimental results using this methodology are shown. A wide range of information about both the transient and steady state thermal performance of LDAs can be acquired from such experimental measurements. These experimental results are compared with simulated numerical temperatures as a means to validate the simulation.
  • Keywords
    laser variables measurement; semiconductor device measurement; semiconductor device models; semiconductor laser arrays; spectral methods of temperature measurement; transient response; LDA reliability; array operating temperature; optical wavelength shift temperature dependence; pulsed laser diode array thermal modeling; steady state thermal performance; temperature measurements; transient thermal performance; wavelength measurements; Diode lasers; Linear discriminant analysis; Numerical simulation; Optical arrays; Optical pulses; Semiconductor laser arrays; Steady-state; Temperature dependence; Temperature measurement; Wavelength measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Thermal Measurement and Management Symposium, 2003. Ninteenth Annual IEEE
  • ISSN
    1065-2221
  • Print_ISBN
    0-7803-7793-1
  • Type

    conf

  • DOI
    10.1109/STHERM.2003.1194385
  • Filename
    1194385