Investigation into the performance of CNT-interconnects by spin coating technique

In this work, we proposed a simple fabrication process, spin coating and dry etching, to construct CNT-interconnects. The CNT-interconnects formed by the slow rate spin coating method have conductivity of more than 10² (S/cm) and the CNT-interconnects with 10² square numbers possess about 30% conductive probability. In addition, we inserted metal bridges into 1000-μm-long CNT-interconnects to effectively facilitate the performance.