• DocumentCode
    3390171
  • Title

    A Discussion of SiC Prospects in Next Electrical Grid

  • Author

    Wu, Rui ; Wen, JiaLiang ; Yu, Kunshan ; Zhao, Dongyuan

  • Author_Institution
    China Electr. Power Res. Inst. (CEPRI), Beijing, China
  • fYear
    2012
  • fDate
    27-29 March 2012
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    Currently, silicon carbide (SiC) technology is developing rapidly. Compared to conventional silicon devices, it has high voltage, high temperature, fast switching speed and low on-resistance and other excellent features. Thus it will play an invaluable role in the next electrical grid. This paper describes the basic characteristics and development of SiC devices. Combined with the future requirements of the grid, it also presents several typical applications of SiC devices in future, such as HVDC, VSC-HVDC, DC grid power technology, solid state power electronics technology.
  • Keywords
    power grids; power semiconductor devices; silicon compounds; wide band gap semiconductors; DC grid power technology; SiC; VSC-HVDC; fast switching speed; high temperature; high voltage; low on-resistance; next electrical grid; solid state power electronics technology; HVDC transmission; Power conversion; Silicon; Silicon carbide;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Power and Energy Engineering Conference (APPEEC), 2012 Asia-Pacific
  • Conference_Location
    Shanghai
  • ISSN
    2157-4839
  • Print_ISBN
    978-1-4577-0545-8
  • Type

    conf

  • DOI
    10.1109/APPEEC.2012.6307214
  • Filename
    6307214