• DocumentCode
    3390284
  • Title

    The arc resistance of binary filled silicone rubber

  • Author

    Lei Jing ; Chen Ruimin ; Lin Chunyao

  • Author_Institution
    Guangdong Electr. Power Res. Inst., Guangzhou, China
  • fYear
    2013
  • fDate
    20-23 Oct. 2013
  • Firstpage
    418
  • Lastpage
    421
  • Abstract
    To research the influence of inorganic fillers on arc resistance of silicone rubber, alumina trihydrate (Al(OH)3, ATH), boron nitride (BN) were chosen as fillers, unary filled and binary filled silicone rubber (SIR) specimens were prepared, the dispersion of organic fillers in SIR were characterized by scanning electron microscope (SEM), arc resistance of each specimen were investigated by high voltage low current arc test, and thermal degradation property was tested by thermogravimetric analysis. The results indicate that ATH unary filled SIR specimens show good performance during the arc test, but decompose seriously and loss much weight. Narrow conducting path forms rapidly when BN filled SIR specimens are exposed to arc discharge. The arc resistance property of ATH and BN binary filled SIR is improved as it takes the advantage of both ATH and BN.
  • Keywords
    aluminium compounds; arcs (electric); boron compounds; scanning electron microscopy; silicone rubber insulators; thermal analysis; ATH unary filled SIR specimens; Al(OH)3; BN; SEM; alumina trihydrate; arc discharge; arc resistance; binary filled silicone rubber; boron nitride; high voltage low current arc test; inorganic fillers; narrow conducting path; scanning electron microscope; thermal degradation property; thermogravimetric analysis; unary filled silicone rubber; Arc discharges; Degradation; Materials; Resistance; Rubber; Thermal stability;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation and Dielectric Phenomena (CEIDP), 2013 IEEE Conference on
  • Conference_Location
    Shenzhen
  • Type

    conf

  • DOI
    10.1109/CEIDP.2013.6748220
  • Filename
    6748220