• DocumentCode
    3392248
  • Title

    Thermomechanical compliant actuator design using meshless topology optimization

  • Author

    Du, Yixian ; Fang, Zifan ; Wu, Zhengjia ; Tian, Qihua

  • Author_Institution
    Coll. of Mech. & Mater. Eng., China Three Gorges Univ., Yichang
  • fYear
    2008
  • fDate
    10-12 Oct. 2008
  • Firstpage
    1018
  • Lastpage
    1025
  • Abstract
    A new topology optimization method for designing thermomechanical compliant actuators using meshless methods is presented. The meshless method is employed to discretize the design domain and the bulk density field, which can avoid the undesirable mesh distortion when the standard finite element method (FEM) is applied. The method for imposing boundary conditions in the meshless method is discussed in details. An interpolation scheme is applied to indicate the dependence of material mechanical and thermal properties on pseudo-densities which are distributed to the related integration points. Furthermore, the design sensitivity analysis is performed by incorporating the adjoint approach into the meshless method. The optimization problem is then solved by the method of moving asymptotes (MMA). The availability of the proposed method is demonstrated by using a widely studied compliant structure.
  • Keywords
    actuators; design engineering; finite element analysis; interpolation; micromechanical devices; optimisation; sensitivity analysis; topology; bulk density field; design sensitivity analysis; finite element method; interpolation scheme; meshless topology optimization; method-of-moving asymptotes; thermomechanical compliant actuator design; undesirable mesh distortion; Actuators; Boundary conditions; Design methodology; Design optimization; Finite element methods; Interpolation; Mechanical factors; Optimization methods; Thermomechanical processes; Topology;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    System Simulation and Scientific Computing, 2008. ICSC 2008. Asia Simulation Conference - 7th International Conference on
  • Conference_Location
    Beijing
  • Print_ISBN
    978-1-4244-1786-5
  • Electronic_ISBN
    978-1-4244-1787-2
  • Type

    conf

  • DOI
    10.1109/ASC-ICSC.2008.4675514
  • Filename
    4675514