DocumentCode
3394992
Title
Enclosure method for reconstruction of 2-D cracks
Author
Wei Sun ; Tian Luan
Author_Institution
Dept. Appl. Sci., Harbin Univ. of Sci. & Technol., Harbin, China
fYear
2011
fDate
19-22 Aug. 2011
Firstpage
1480
Lastpage
1483
Abstract
In this paper, we discuss the reconstruction of cracks which are segments in a planar conductoran inverse geometry problem of Laplace equation. The singular behavior at the tip of cracks is investigated. Enclosure method is proposed to detect surface cracks and interior cracks. Also we developed an algorithm to locate cracks with an angle.
Keywords
Laplace equations; crack detection; surface cracks; 2-d cracks reconstruction; Laplace equation; cracks inspection; enclosure method; inverse geometry problem; planar conductor; surface cracks; Algorithm design and analysis; Conductors; Electric potential; Electrostatic measurements; Inspection; Inverse problems; Surface cracks; Green formulation; enclosure method; inverse problem; laplace equation;
fLanguage
English
Publisher
ieee
Conference_Titel
Mechatronic Science, Electric Engineering and Computer (MEC), 2011 International Conference on
Conference_Location
Jilin
Print_ISBN
978-1-61284-719-1
Type
conf
DOI
10.1109/MEC.2011.6025752
Filename
6025752
Link To Document