DocumentCode
3395253
Title
Coarse grained molecular dynamics simulation of thermosetting resins in nanocomposite
Author
Sawa, Fumio ; Imai, Takahiro ; Ozaki, Tamon ; Shimizu, Toshio ; Tanaka, Toshikatsu
Author_Institution
Power & Ind. Syst. R&D Center, Toshiba Corp., Yokohama, Japan
fYear
2009
fDate
19-23 July 2009
Firstpage
853
Lastpage
856
Abstract
Epoxy-based polymer nanocomposites are promising materials for high voltage insulation in industrial use because they have advantages in some properties such as thermal resistivity, mechanical toughness and good V-t characteristics. In polymer nanocomposites, interfaces between fillers and polymer matrices are considered to play a predominant role because they have much larger interface areas than in microcomposites. The coarse-grained molecular dynamics simulation, based on the bead-spring model in polymer physics, is a powerful tool for interpreting the morphology and dynamics of polymer chains. In this study, a coarse-grained molecular dynamics simulation including a reaction model of monomers such as chief ingredients and hardener was conducted to investigate the thermodynamic properties of the interface between nano-fillers and thermosetting resins. Simulation results indicate that the dynamics of network chains close to the nano-filler surfaces is different from the bulk regions. This result will give in-depth analysis of interfacial problems of nano-composites.
Keywords
epoxy insulation; filled polymers; molecular dynamics method; nanocomposites; V-t characteristics; bead-spring model; coarse grained molecular dynamics simulation; epoxy-based polymer nanocomposites; high voltage insulation; mechanical toughness; monomers; nanofillers; polymer chains; thermal resistivity; thermosetting resins; Conductivity; Mechanical factors; Nanostructured materials; Physics; Plastic insulation; Plastics industry; Polymers; Resins; Thermal resistance; Voltage; Coarse-grained molecular dynamics simulation; Polymer nanocomposites; Thermosetting resin;
fLanguage
English
Publisher
ieee
Conference_Titel
Properties and Applications of Dielectric Materials, 2009. ICPADM 2009. IEEE 9th International Conference on the
Conference_Location
Harbin
Print_ISBN
978-1-4244-4367-3
Electronic_ISBN
978-1-4244-4368-0
Type
conf
DOI
10.1109/ICPADM.2009.5252214
Filename
5252214
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