DocumentCode :
3395810
Title :
Analytical modeling of device-circuit interactions for the power insulated gate bipolar transistor (IGBT)
Author :
Hefner, Allen R., Jr.
Author_Institution :
NBS, Gaithersburg, MD, USA
fYear :
1988
fDate :
2-7 Oct. 1988
Firstpage :
606
Abstract :
The device-circuit interactions of the IGBT for a series resistor-inductor load, both with and without a snubber, are simulated. An analytical model for the transient operation of the IGBT is used in conjunction with the load circuit state equations for the simulations. The simulated results are compared with experimental results for all conditions. Devices with a variety of base lifetimes are studied. For the fastest devices studied (base lifetime=0.3 mu s), the voltage overshoot of the series resistor-inductor load circuit approaches the device voltage rating (500 V) for load inductances greater than 1 mu H. For slower devices the overshoot is much less, and a larger inductance can therefore be switched without a snubber circuit (e.g. 80 mu H for a 7.1- mu s device). The simulations are used to determine the conditions for which the different devices can be switched to safety without a snubber protection circuit. Simulations are also used to determine the required values and ratings for protection circuit components when protection circuits are necessary.<>
Keywords :
bipolar transistors; insulated gate field effect transistors; power transistors; semiconductor device models; 0.3 mus; 500 V; IGBT; analytical model; device-circuit interactions; load circuit state equations; power insulated gate bipolar transistor; protection circuit components; series resistor-inductor load; snubber; transient operation; voltage overshoot; Analytical models; Circuit simulation; Equations; Inductance; Insulated gate bipolar transistors; Protection; Snubbers; Switching circuits; Transient analysis; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Industry Applications Society Annual Meeting, 1988., Conference Record of the 1988 IEEE
Conference_Location :
Pittsburgh, PA, USA
Type :
conf
DOI :
10.1109/IAS.1988.25124
Filename :
25124
Link To Document :
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