DocumentCode
3396252
Title
Analysis of noise coupling from printed circuit board to shielding enclosure
Author
Zhenwei Yu ; Dong, Xiaopeng ; Mix, Jason ; Slattery, K. ; Jun Fan
Author_Institution
UMR/MST EMC Lab., Missouri Univ. of Sci. & Technol. (formerly Univ. of Missouri-Rolla), Rolla, MO
fYear
2008
fDate
27-29 Oct. 2008
Firstpage
159
Lastpage
162
Abstract
The power distribution network in a printed circuit board (PCB) inside a compact-size enclosure is an effective path for high-speed digital noise to be coupled to the RF receivers inside the same enclosure, causing RF interference (RFI) issues. This noise coupling mechanism from PCB to shielding enclosure is investigated in this paper using the cavity model and the segmentation technique. In this approach, the structure of an enclosure with a PCB inside is divided into cavities with both horizontal and vertical connections. Modeling result agrees well with full wave simulations, and the simulation time is considerably reduced. Furthermore, the relationship among the noise coupling, the PCB-related resonances, and the enclosure-related resonances is studied as well.
Keywords
couplings; electromagnetic shielding; printed circuits; radio receivers; radiofrequency interference; RF interference; RF receivers; cavity model; compact-size enclosure; enclosure-related resonances; full wave simulations; high-speed digital noise; noise coupling analysis; noise coupling mechanism; power distribution network; printed circuit board; segmentation technique; shielding enclosure; Circuit noise; Coupling circuits; Electromagnetic compatibility; Electromagnetic interference; Finite difference methods; Geometry; Laboratories; Printed circuits; Radio frequency; Resonance;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 2008 IEEE-EPEP
Conference_Location
San Jose, CA
Print_ISBN
978-1-4244-2873-1
Type
conf
DOI
10.1109/EPEP.2008.4675902
Filename
4675902
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