DocumentCode
3396464
Title
Sensitivity computation of interconnect capacitances with respect to geometric parameters
Author
Bi, Yu ; van der Kolk, K. ; Ioan, D. ; Van Der Meijs, N.P.
Author_Institution
EEMCS, Delft Univ. of Technol., Delft
fYear
2008
fDate
27-29 Oct. 2008
Firstpage
209
Lastpage
212
Abstract
This paper presents an algorithm that enables an extension of standard 3d capacitance extraction to take into account the effects of small dimensional variations of interconnects by calculating the corresponding capacitance sensitivities. By using an adjoint technique, capacitances and their sensitivities w.r.t. multiple geometric parameters can be obtained with one-time 3d extraction using the boundary element method (BEM).
Keywords
boundary-elements methods; capacitance; feature extraction; integrated circuit interconnections; IC interconnects; boundary element method; capacitance sensitivities; geometric parameters; interconnect capacitance; one-time 3d extraction; sensitivity computation; Bismuth; Boundary element methods; Capacitance; Circuit optimization; Conductors; Integrated circuit interconnections; SPICE; Signal analysis; Solid modeling; Symmetric matrices;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 2008 IEEE-EPEP
Conference_Location
San Jose, CA
Print_ISBN
978-1-4244-2873-1
Type
conf
DOI
10.1109/EPEP.2008.4675916
Filename
4675916
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