• DocumentCode
    3396596
  • Title

    Eliminating via-plane coupling using ground vias for high-speed signal transitions

  • Author

    Songping Wu ; Xin Chang ; Schuster, Christian ; Gu, Xiaoxiong ; Jun Fan

  • Author_Institution
    UMR/MST EMC Lab., Missouri Univ. of Sci. & Technol., Rolla, MO
  • fYear
    2008
  • fDate
    27-29 Oct. 2008
  • Firstpage
    247
  • Lastpage
    250
  • Abstract
    When a high-speed signal transits through a via that penetrates a plane pair, parallel-plane resonances can cause additional insertion loss for the signal. To eliminate this via-plane coupling, ground vias are added adjacent to the signal via. This paper discusses the impact of the ground vias as a function of the number of the ground vias, their locations, and the size of the plane pair. A block-by-block physics-based equivalent circuit modeling approach is used in the study. The underlying physics of the phenomenon and the design implications are also discussed in the paper.
  • Keywords
    equivalent circuits; integrated circuit modelling; printed circuit design; equivalent circuit modeling; ground vias; high-speed signal transitions; insertion loss; parallel-plane resonance; plane pair; printed circuit boards; via-plane coupling; Design engineering; Equivalent circuits; Geometry; High speed integrated circuits; Insertion loss; Integrated circuit modeling; Nonhomogeneous media; Packaging; Physics; Solid modeling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Performance of Electronic Packaging, 2008 IEEE-EPEP
  • Conference_Location
    San Jose, CA
  • Print_ISBN
    978-1-4244-2873-1
  • Type

    conf

  • DOI
    10.1109/EPEP.2008.4675926
  • Filename
    4675926