Title :
Bay level IED modeling and realizing using IEC 61850
Author :
Xu, Tianqi ; Yin, Xianggen ; You, Dahai ; Yu, Hongwei ; Wang, Yangguang ; Hou, Hui
Author_Institution :
Electr. Power Security & High Efficiency Lab., Huazhong Univ. of Sci. & Technol., Wuhan
Abstract :
Interoperability is the most important objective of IEC 61850. Model design and realization are critical steps to implement IEC 61850 and achieve interoperability. Based on analysis of interoperability support, a universal design method of IED model is given, and problems of bay level IED model realization are analyzed. Bay level IED is embedded system, and its information models are usually realized in the form of data structures. Several existing data structures are analyzed with the view point of interoperability. And a new data structure named as ASCI-FC-data structure is designed. Unlike other data structure, it includes FCs (functional constraints), and shows the true hierarchical structure of information model at the same time, which makes it better to support interoperability. Then data store structure making use of binary chain list is given with examples to prove the advantages of it in object locating and traversing. A method of FC filtering for ASCI-FC-data structure stored in binary chain list is also given to show the advantages of this data structure.
Keywords :
IEC standards; data structures; embedded systems; open systems; substation automation; ASCI-FC-data structure; FC filtering; IEC 61850; bay level IED modeling; embedded system; functional constraints; hierarchical structure; interoperability support; substation; Communication networks; Communication standards; Communication system control; Data structures; Design methodology; Embedded system; IEC standards; Object oriented modeling; Substations; Synthetic aperture sonar; Bay Level IED; IEC 61850; Model;
Conference_Titel :
Transmission and Distribution Conference and Exposition, 2008. T&D. IEEE/PES
Conference_Location :
Chicago, IL
Print_ISBN :
978-1-4244-1903-6
Electronic_ISBN :
978-1-4244-1904-3
DOI :
10.1109/TDC.2008.4517164