Title :
A novel smart pixel network for signal processing applications
Author :
Sayles, A.N. ; Shoop, B.L. ; Ressler, E.K.
Author_Institution :
Dept. of Electr. Eng. & Comput. Sci., US Mil. Acad., West Point, NY, USA
Abstract :
Taking advantage of the versatility of silicon integrated circuits and the developing flip chip bonding technology, we have designed a smart pixel neural network for digital image halftoning applications and implemented the electronics portion of the system in CMOS.
Keywords :
CMOS integrated circuits; flip-chip devices; optical information processing; optical neural nets; smart pixels; CMOS electronics; Si; digital image halftoning; flip chip bonding; signal processing; silicon integrated circuit; smart pixel neural network; Application specific integrated circuits; Bonding; CMOS digital integrated circuits; CMOS integrated circuits; CMOS technology; Flip chip; Integrated circuit technology; Signal processing; Silicon; Smart pixels;
Conference_Titel :
Advanced Applications of Lasers in Materials Processing/Broadband Optical Networks/Smart Pixels/Optical MEMs and Their Applications. IEEE/LEOS 1996 Summer Topical Meetings:
Conference_Location :
Keystone, CO, USA
Print_ISBN :
0-7803-3175-3
DOI :
10.1109/LEOSST.1996.540757
