8/spl times/8 array of smart pixels fabricated through the Vitesse foundry integrating MESFET, MSM, and VCSEL elements

This paper presents a new smart pixel design for a database filter which combines the four chips of a previous system into a single component chip. This eliminates many of the optical components, dramatically reduces the size of the system, and simplifies the optical alignment. The redesigned chip is being fabricated by Vitesse through the MOSIS foundry and uses MSM photodetectors and MESFETs instead of heterojunction phototransistors. VCSELs are flip-chip bump bonded to each pixel using a coplanar bonding technique similar to that developed by Goossen, et. al. (1995) for SEED devices. The paper will describe the pixel design and measured characteristics.