Title :
HDL to SP conversion containing interconnect effects using SAD matrix
Author :
Golzar, Manouchehr Ghahramanian ; Tajozzakerin, HamidReza
Author_Institution :
AsanPardazan Co., Tehran, Iran
Abstract :
This paper introduces a new method to take into account the effects of interconnects in simulations of modern digital circuits. It is possible in this technique to take into account the impact of interconnects in early stages of high level design with no need of layout information. In this method the description of the circuit is modeled as a graph. This graph is shown in a new shape of adjacency matrix which is optimized in terms of number of vertices rather than a regular adjacency matrix. We call this new matrix the sad-mat. The sad-mat is stored in computer memory by means of linked lists. The algorithm used by the previous work on HDL to SP Conversion was NP-Complete. The proposed method in this paper uses a new algorithm which has complexity O(log n) where n is total number of primitive inputs and outputs and none- primitive nodes in the circuit. This new method has been applied to many standard ISCAS circuits and the output results have shown a significant improvement in terms of running time. The proposed method is implemented as a CAD tool called H2SP. ISCAS circuits are also used to verify the H2SP´s algorithm.
Keywords :
circuit complexity; hardware description languages; high level synthesis; integrated circuit interconnections; matrix algebra; CAD tool; H2SP; HDL; ISCAS circuits; NP-complete; SAD matrix; SP conversion; adjacency matrix; computational complexity; computer memory; high level design; interconnect effects; layout information; linked lists; modern digital circuits; none- primitive nodes; sad-mat; Design automation; Force; Hardware design languages; Matrix converters; Packaging; Simulation; Solid modeling; H2SP Tool; Hardware Description Language; Interconnect Models; Prediction; SAD Matrix; converter;
Conference_Titel :
Circuits and Systems (MWSCAS), 2011 IEEE 54th International Midwest Symposium on
Conference_Location :
Seoul
Print_ISBN :
978-1-61284-856-3
Electronic_ISBN :
1548-3746
DOI :
10.1109/MWSCAS.2011.6026461