Title :
On the design of coplanar waveguide bond wires as transmission lines
Author_Institution :
Lucent Technol., Bell Labs., Holmdel, NJ, USA
Abstract :
A packaging structure has been proposed such that coplanar bond wires may be maintained at a constant height above the device substrate and so function as a transmission line. The characteristic impedance of such a “coplanar wire waveguide” transmission line has been determined as a function of its wire spacing and height above the substrate. The large sensitivity to height above the substrate is shown, thus requiring great precision in maintaining that height in a practical arrangement
Keywords :
coplanar transmission lines; coplanar waveguides; integrated optoelectronics; packaging; printed circuits; characteristic impedance; constant height; coplanar bond wires; coplanar waveguide bond wired transmission line design; coplanar wire waveguide transmission line; device substrate; great precision; large sens; packaging structure; substrate; transmission line; wire spacing; Bonding; Coplanar transmission lines; Coplanar waveguides; Dielectric constant; Dielectric substrates; Impedance; Microstrip; Packaging; Transmission lines; Wires;
Conference_Titel :
LEOS '99. IEEE Lasers and Electro-Optics Society 1999 12th Annual Meeting
Conference_Location :
San Francisco, CA
Print_ISBN :
0-7803-5634-9
DOI :
10.1109/LEOS.1999.811975
