• DocumentCode
    3408308
  • Title

    Inductive-coupling interfaces for high-speed low-power proximity communications

  • Author

    Hayun Chung ; Kuroda, Tadahiro

  • Author_Institution
    Dept. of Electron. & Electr. Eng., Keio Univ., Yokohama, Japan
  • fYear
    2011
  • fDate
    7-10 Aug. 2011
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    Inductive-coupling interfaces provide high-speed, low-power and cost-efficient solutions in proximity communications. Synchronous pulse-based inductive-coupling transceivers have been applied to a wide range of applications, such as through-chip interface, non-contact memory and wafer-level testing.
  • Keywords
    low-power electronics; three-dimensional integrated circuits; transceivers; wafer-scale integration; high-speed low-power proximity communications; inductive-coupling interfaces; non-contact memory; synchronous pulse-based inductive-coupling transceivers; through-chip interface; wafer-level testing; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Circuits and Systems (MWSCAS), 2011 IEEE 54th International Midwest Symposium on
  • Conference_Location
    Seoul
  • ISSN
    1548-3746
  • Print_ISBN
    978-1-61284-856-3
  • Electronic_ISBN
    1548-3746
  • Type

    conf

  • DOI
    10.1109/MWSCAS.2011.6026621
  • Filename
    6026621
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3408308