DocumentCode :
3416067
Title :
IPMs solving major reliability issues in automotive applications [intelligent power module]
Author :
Hussein, K.H. ; Majurndar ; Yoshida, S. ; Maekawa, H.
Author_Institution :
Mitsubishi Electr. Power Device Works, Japan
fYear :
2004
fDate :
24-27 May 2004
Firstpage :
89
Lastpage :
92
Abstract :
In automotive applications, particularly the newly emerging hybrid electric vehicles (HEV), the high power ratings (10-100 kW peak), together with the high temperature associated with the engine room, subject the IPM (intelligent power module) to severe thermal operating conditions. Therefore, in addition to the well known requirements of improved IPM electrical characteristics and optimized system cost-performance (functional integration), reliability and durability become very important factors in HEV applications. This paper highlights the IPM system model for HEV: the intelligent integrated power drive unit (IPU) which, through efficient power chips, built-in detection, protection, and optimized package layout, pushes forward more functional integration and satisfies the HEV reliability requirements. The IPU thermal management (in terms of package layout and on-chip temperature sensing) and short-circuit protection circuits are introduced as examples.
Keywords :
automotive electronics; circuit reliability; hybrid electric vehicles; modules; power electronics; power integrated circuits; thermal management (packaging); 10 to 100 kW; HEV; IPM durability; IPM reliability; IPU; automotive intelligent power module; built-in protection; high engine room temperature; hybrid electric vehicles; intelligent integrated power drive unit; on-chip temperature sensing; package layout; power chips; short-circuit protection; thermal management; thermal operating conditions; Circuit reliability; Power electronics; Power integrated circuits; Road vehicle electronics;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Power Semiconductor Devices and ICs, 2004. Proceedings. ISPSD '04. The 16th International Symposium on
Print_ISBN :
4-88686-060-5
Type :
conf
DOI :
10.1109/ISPSD.2004.1332866
Filename :
1332866
Link To Document :
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